A Fully-Integrated MMIC Technology Employing a Novel Chip-Size Package
نویسندگان
چکیده
منابع مشابه
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...
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In conventional WLCSP process, after defining the under bump metal (UBM) layer, a solder ball is dropped in the UBM opening. A subsequent thermal reflow cycle melts the solder ball and cools it in a well defined shape on top of the UBM layer. One draw back of this technology is the fracture or cracking of passivation film that may occur during the solder ball reflow process. The cracks in the p...
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ژورنال
عنوان ژورنال: IEEJ Transactions on Electronics, Information and Systems
سال: 2004
ISSN: 0385-4221,1348-8155
DOI: 10.1541/ieejeiss.124.303